MPC823PIN3.pdf

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Mechanical Data and Ordering Information
24.3 PACKAGE DIMENSIONS–PLASTIC BALL GRID ARRAY (PBGA)
For more information on the printed circuit board layout of the PBGA package, including
thermal via design and suggested pad layout, please refer to AN-1231/D,
Plastic Ball Grid
Array Application Note
available from your local Motorola sales office.
256X
0.20 C
0.35 C
A
D
D2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO
PRIMARY DATUM C.
4. PRIMARY DATUM C AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
MILLIMETERS
MIN
MAX
1.91
2.35
0.50
0.70
1.12
1.22
0.29
0.43
0.60
0.90
23.00 BSC
19.05 REF
19.00
20.00
23.00 BSC
19.05 REF
19.00
20.00
1.27 BSC
Y
TOP VIEW
E
E2
4X
0.20
A2
A3
A1
A
C
SEATING
PLANE
IN
B
AR
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
(D1)
15X
e
SIDE VIEW
15X
e
PR
EL
(E1)
4X
e /2
IM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
256X
b
0.30
M
M
C A B
C
BOTTOM VIEW
0.15
CASE 1130-01
ISSUE A
MOTOROLA
MPC823 USER’S MANUAL
24-3
24
MECHANICAL DATA AND
ORDERING INFORMATION
DIM
A
A1
A2
A3
b
D
D1
D2
E
E1
E2
e

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